产品技术
主要产品
核心技术

Standard Coreless

3Layers to 18Layers

Even layer

Description: ACCESS provides a unique coreless technique to realize ultra thin thickness and fine line design with excellent thermal heat dissipation by Cu pillar technology and good electrical performance due to the short electrical path between layer to layer. It allows a flexible design rule and full stacked-via technology.
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Odd layer

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Applications:
CPU, GPU and Chipset for Desktop / Game Console
DTV Chip Controller, Blu-Ray Chip Controller
Networking / Portable
ASICs
PA Module, Blue Tooth GPS for Wireless / Communication